Daoguo Li,: search on Z-Library

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1

Influence of microstructure inhomogeneity on the current density and temperature gradient in microscale line-type Sn58Bi solder joints under current stressing

Qin, Hongbo, Liu, Tianhan, Li, Wangyun, Yue, Wu, Yang, Daoguo

Journal:

Microelectronics Reliability

Year:

2020

File:

PDF, 9.56 MB

2020

2

Effects of High-Temperature Storage on the Elasticity Modulus of an Epoxy Molding Compound

Li, Ruifeng, Yang, Daoguo, Zhang, Ping, Niu, Fanfan, Cai, Miao, Zhang, Guoqi

Journal:

Year:

2019

Language:

english

File:

PDF, 15.62 MB

english, 2019

3

[IEEE 2018 19th International Conference on Electronic Packaging Technology (ICEPT) - Shanghai, China (2018.8.8-2018.8.11)] 2018 19th International Conference on Electronic Packaging Technology (ICEPT) - A First Principles Study of Blue Phosphorene as A Superior Media for Gas Sensor

Niu, Fanfan, Yang, Daoguo, Cai, Miao, Li, Xiaoling, Liu, Dongjing

Year:

2018

Language:

english

File:

PDF, 1.53 MB

english, 2018

4

Global well-posedness for the 2D fractional Boussinesq Equations in the subcritical case

Zhou, Daoguo, Li, Zilai, Shang, Haifeng, Wu, Jiahong, Yuan, Baoquan, Zhao, Jiefeng

Journal:

Pacific Journal of Mathematics

Year:

2019

Language:

english

File:

PDF, 437 KB

english, 2019

5

SPIE Proceedings [SPIE Electronic Imaging 2002 - San Jose, CA (Saturday 19 January 2002)] Storage and Retrieval for Media Databases 2002 - Angle-Tree: a new index structure for high-dimensional point data

Dong, Daoguo, Xue, Xiangyang, Luo, Hangzai, Lin, Yingqiang, Yeung, Minerva M., Li, Chung-Sheng, Lienhart, Rainer W.

Year:

2001

Language:

english

File:

PDF, 558 KB

english, 2001

6

Parametric matching selection approach for Satellite Gear Mechanism

Ping, Yang, Zhihua, Li, Daoguo, Yang

Journal:

International Journal of Product Development

Year:

2008

Language:

english

File:

PDF, 212 KB

english, 2008

7

Thermal Properties of Graphene Filled Polymer Composite Thermal Interface Materials

Zhang, Ping, Zeng, Jianhua, Zhai, Siping, Xian, Yaoqi, Yang, Daoguo, Li, Qiang

Journal:

Macromolecular Materials and Engineering

Year:

2017

Language:

english

File:

PDF, 2.48 MB

english, 2017

8

Evaluation survey of microbial disinfection methods in UV-LED water treatment systems

Li, Xiaoling, Cai, Miao, Wang, Lei, Niu, Fanfan, Yang, Daoguo, Zhang, Guoqi

Journal:

Science of The Total Environment

Year:

2019

Language:

english

File:

PDF, 1.10 MB

english, 2019

9

Degradation Mechanisms of Mid-Power White-Light LEDs Under High-Temperature–Humidity Conditions

Huang, Jianlin, Golubovic, Dusan S, Koh, Sau, Yang, Daoguo, Li, Xiupeng, Fan, X. J., Zhang, G. Q.

Journal:

IEEE Transactions on Device and Materials Reliability

Year:

2015

Language:

english

File:

PDF, 1.47 MB

english, 2015

10

A novel technique for micro-hole forming on skull with the assistance of ultrasonic vibration

Li, Zhe, Yang, Daoguo, Hao, Weidong, Wu, Tiecheng, Wu, Song, Li, Xiaoping

Journal:

Journal of the Mechanical Behavior of Biomedical Materials

Year:

2016

Language:

english

File:

PDF, 5.03 MB

english, 2016

11

Effects of High-Temperature Storage on the Elasticity Modulus of an Epoxy Molding Compound

Li, Ruifeng, Yang, Daoguo, Zhang, Ping, Niu, Fanfan, Cai, Miao, Zhang, Guoqi

Journal:

Year:

2019

File:

PDF, 15.62 MB

2019

12

A Salmonella inositol polyphosphatase acts in conjunction with other bacterial effectors to promote host cell actin cytoskeleton rearrangements and bacterial internalization

Daoguo Zhou, Li-Mei Chen, Lorraine Hernandez, Stephen B. Shears, Jorge E. Galán

Journal:

Molecular Microbiology

Year:

2001

Language:

english

File:

PDF, 300 KB

english, 2001

13

Influence of Pressure on the Mechanical and Electronic Properties of Wurtzite and Zinc-Blende GaN Crystals

Qin, Hongbo, Kuang, Tianfeng, Luan, Xinghe, Li, Wangyun, Xiao, Jing, Zhang, Ping, Yang, Daoguo, Zhang, Guoqi

Journal:

Year:

2018

Language:

english

File:

PDF, 6.26 MB

english, 2018

14

[IEEE 2005 6th International Conference on Electronics Packaging Technology - Shenzhen, China (30 Aug.-2 Sept. 2005)] 2005 6th International Conference on Electronic Packaging Technology - The application of RSM in optimization of the curing profile for electronic packaging polymers

Fuhong Huang,, Yubing Gong,, Quanyong Li,, Daoguo Yang,

Year:

2005

Language:

english

File:

PDF, 449 KB

english, 2005

15

Detection of Acute Tonic Cold Pain From Microwave Transcranial Transmission Signals Obtained via the Microwave Scattering Approach

Geng, Daoshuang, Yang, Daoguo, Cai, Miao, Hao, Weidong, Li, Xiaoming

Journal:

Year:

2019

Language:

english

File:

PDF, 3.00 MB

english, 2019

16

New analysis method for radiation modeling and sterilization effect of UVC-LED module

Li, Xiaoling, Yang, Daoguo, Cai, Miao

Journal:

IOP Conference Series Materials Science and Engineering

Year:

2018

File:

PDF, 648 KB

2018

17

Gas molecular adsorption effects on the electronic and optical properties of monolayer SnP3

Niu, Fanfan, Cai, Miao, Pang, Jiu, Li, Xiaoling, Yang, Daoguo, Zhang, Guoqi

Journal:

Year:

2019

Language:

english

File:

PDF, 1.82 MB

english, 2019

18

Global well-posedness for the 2D Boussinesq equations with zero viscosity

Zhou, Daoguo, Li, Zilai

Journal:

Journal of Mathematical Analysis and Applications

Year:

2017

Language:

english

File:

PDF, 289 KB

english, 2017

19

[IEEE 2018 19th International Conference on Electronic Packaging Technology (ICEPT) - Shanghai (2018.8.8-2018.8.11)] 2018 19th International Conference on Electronic Packaging Technology (ICEPT) - Design and Optimization of a Novel Silicone Rubber Elastic Button based on BPNN Model

Wang, Siyu, Liang, Zhi, Yang, Zhangping, Cai, Miao, Yang, Daoguo, Li, Jinyang

Year:

2018

File:

PDF, 8 KB

2018

20

Rapid degradation of mid-power white-light LEDs in saturated moisture conditions

Huang, Jianlin, golubovic, Dusan, Koh, Sau, Yang, Daoguo, Li, Xiupeng, Fan, Xuejun, Zhang, Guoqi

Journal:

IEEE Transactions on Device and Materials Reliability

Year:

2015

Language:

english

File:

PDF, 4.01 MB

english, 2015

21

[IEEE 2019 20th International Conference on Electronic Packaging Technology(ICEPT) - Hong Kong, China (2019.8.12-2019.8.15)] 2019 20th International Conference on Electronic Packaging Technology(ICEPT) - Analysis of Temperature Response Characteristics of Voltage RMS Sensor Packaging Based on Diode

Wang, Xiyou, Yang, Daoguo, Fan, Yasong, Li, Wangyun

Year:

2019

File:

PDF, 2.83 MB

2019

22

Identification of a novel Salmonella type III effector by quantitative secretome profiling

Cheng, Sen, Wang, Lu, Liu, Qian, Qi, Linlu, Yu, Kaiwen, Wang, Zhen, Wu, Mei, Liu, Yanhua, Fu, Jiaqi, Hu, Mo, Li, Min, Zhou, Daoguo, Liu, Xiaoyun

Journal:

Molecular & Cellular Proteomics

Year:

2017

Language:

english

File:

PDF, 1.19 MB

english, 2017

23

Lithium Titanate Matrix-Supported Nano-Crystalline Silicon Film as an Anode for Lithium-Ion Batteries

Yu, Zhaozhe, Tian, Bingbing, Li, Ying, Fan, Dianyuan, Yang, Daoguo, Zhu, Guisheng, Cai, Miao, Yan, Dongliang

Journal:

ACS Applied Materials & Interfaces

Year:

2018

Language:

english

File:

PDF, 1.06 MB

english, 2018

24

Degradation modeling of mid-power white-light LEDs by using Wiener process

Huang, Jianlin, Golubović, Dušan S, Koh, Sau, Yang, Daoguo, Li, Xiupeng, Fan, Xuejun, Zhang, G.Q.

Journal:

Year:

2015

Language:

english

File:

PDF, 1.93 MB

english, 2015

25

[IEEE 2014 Joint IEEE International Symposium on the Applications of Ferroelectrics, International Workshop on Acoustic Transduction Materials and Devices & Workshop on Piezoresponse Force Microscopy (ISAF/IWATMD/PFM) - State College, PA, USA (2014.5.12-2014.5.16)] 2014 Joint IEEE International Symposium on the Applications of Ferroelectric, International Workshop on Acoustic Transduction Materials and Devices & Workshop on Piezoresponse Force Microscopy - Mold flow analysis of molding process for a MEMS fingerprint sensor package

Li, Guoxing, Yang, Daoguo, Li, Ruifeng, Cai, Miao, Li, Chao, Wang, Lingen

Year:

2014

Language:

english

File:

PDF, 735 KB

english, 2014

26

[IEEE 2008 IEEE International Conference on Automation and Logistics (ICAL) - Qingdao, China (2008.09.1-2008.09.3)] 2008 IEEE International Conference on Automation and Logistics - Improvement of decision table attribute reduction algorithm based on Discernibility Matrix

Daoguo Li,, Hualong Ma,, Yiqi Yin,

Year:

2008

Language:

english

File:

PDF, 172 KB

english, 2008

27

Involvement of TIP60 acetyltransferase in intracellularSalmonellareplication

Xueqin Wang, Dongju Li, Di Qu, Daoguo Zhou

Journal:

BMC Microbiology

Year:

2010

Language:

english

File:

PDF, 1.16 MB

english, 2010

28

Dual 4- and 5-phosphatase activities regulate SopB-dependent phosphoinositide dynamics to promote bacterial entry

Piscatelli, Heather L., Li, Menghan, Zhou, Daoguo

Journal:

Cellular Microbiology

Year:

2016

Language:

english

File:

PDF, 3.44 MB

english, 2016

29

SPIE Proceedings [SPIE Photonics Asia 2002 - Shanghai, China (Monday 14 October 2002)] Holography, Diffractive Optics, and Applications - New type of demultiplexer based on volume holography technique

Guo, Hanming, Jiang, Daoguo, Chen, Jiabi, Ma, Junshan, Li, Xiangning, Tang, Meng, Zhuang, Songlin, Hsu, Dahsiung, Chen, Jiabi, Sheng, Yunlong

Year:

2002

Language:

english

File:

PDF, 135 KB

english, 2002

30

A Salmonella inositol polyphosphatase acts in conjunction with other bacterial effectors to promote host cell actin cytoskeleton rearrangements and bacterial internalization

Daoguo Zhou, Li-Mei Chen, Lorraine Hernandez, Stephen B. Shears, Jorge E. Galán

Journal:

Molecular Microbiology

Year:

2001

Language:

english

File:

PDF, 30 KB

english, 2001

31

[IEEE 2020 21st International Conference on Electronic Packaging Technology (ICEPT) - Guangzhou, China (2020.8.12-2020.8.15)] 2020 21st International Conference on Electronic Packaging Technology (ICEPT) - Optimization Design of Flexible Gas Senor Microheater

Wang, Jing, Yang, Daoguo, Chang, Tien-Li, Cui, Peng, Duan, Yi, Ye, Weibin

Year:

2020

File:

PDF, 2.90 MB

2020

32

[IEEE 2020 21st International Conference on Electronic Packaging Technology (ICEPT) - Guangzhou, China (2020.8.12-2020.8.15)] 2020 21st International Conference on Electronic Packaging Technology (ICEPT) - Void Eliminating Process of Sintered-Silver Die Attachment in Anaerobic-Sintering Atmospheres

Liang, Peijie, Yan, Haidong, Li, Wangyun, Yang, Daoguo

Year:

2020

File:

PDF, 3.88 MB

2020

33

[IEEE 2005 IEEE International Conference on Granular Computing - Beijing, China (2005.07.27-2005.07.27)] 2005 IEEE International Conference on Granular Computing - Fuzzy rough set and its improvement

Duoqian Miao,, Daoguo Li,, Shidong Fan,

Year:

2005

Language:

english

File:

PDF, 604 KB

english, 2005

34

SPIE Proceedings [SPIE Electronic Imaging 2004 - San Jose, CA (Sunday 18 January 2004)] Storage and Retrieval Methods and Applications for Multimedia 2004 - A fast video clip retrieval algorithm based on VA-file

Liu, Fangjie, Dong, DaoGuo, Miao, Xiaoping, Xue, XiangYang, Yeung, Minerva M., Lienhart, Rainer W., Li, Chung-Sheng

Year:

2003

Language:

english

File:

PDF, 113 KB

english, 2003

35

[IEEE 2005 Conference on High Density Microsystem Design and Packaging and Component Failure Analysis - Shanghai, China (2005.6.27-2005.6.27)] 2005 Conference on High Density Microsystem Design and Packaging and Component Failure Analysis - Study on the fatigue life of the FC-BGA solder joints with Damage

Yubing, Gong, QuanYong, Li, Daoguo, Yang

Year:

2006

Language:

english

File:

PDF, 272 KB

english, 2006

36

Lumen degradation modeling of white-light LEDs in step stress accelerated degradation test

Huang, Jianlin, Golubović, Dušan S, Koh, Sau, Yang, Daoguo, Li, Xiupeng, Fan, Xuejun, Zhang, G.Q.

Journal:

Reliability Engineering & System Safety

Year:

2016

Language:

english

File:

PDF, 855 KB

english, 2016

37

[IEEE ICEPT 2003. Fifth International Conference on Electronic Packaging Technology. Proceedings - Shanghai, China (2003.10.28-2003.10.30)] Fifth International Conference onElectronic Packaging Technology Proceedings, 2003. ICEPT2003. - Study on simulation-based optimization for flip chip package parameters by using RSM analysis and Ant algorithm

Quanyong Li,, Yubing Gong,, Daoguo Yang,, Junsheng Liang,

Year:

2003

Language:

english

File:

PDF, 306 KB

english, 2003

38

[IEEE 2008 International Conference on Information and Automation (ICIA) - Changsha, China (2008.06.20-2008.06.23)] 2008 International Conference on Information and Automation - A knowledge acquisition approach based on the inclusion degree and granular computing

Daoguo Li,, Dexin Luan,, Dawei Liu,

Year:

2008

Language:

english

File:

PDF, 119 KB

english, 2008

39

Degradation Mechanism Decoupling of Mid-Power White-Light LEDs by SPD Simulation

Huang, Jianlin, Golubovic, Dusan S., Koh, Sau, Yang, Daoguo, Li, Xiupeng, Fan, Xuejun, Zhang, Guoqi

Journal:

IEEE Transactions on Electron Devices

Year:

2016

Language:

english

File:

PDF, 2.10 MB

english, 2016

40

[IEEE 2014 15th International Conference on Electronic Packaging Technology (ICEPT) - Chengdu, China (2014.8.12-2014.8.15)] 2014 15th International Conference on Electronic Packaging Technology - Mold flow analysis of molding process for a MEMS fingerprint sensor package

Li, Guoxing, Yang, Daoguo, Li, Ruifeng, Cai, Miao, Li, Chao, Wang, Lingen

Year:

2014

Language:

english

File:

PDF, 735 KB

english, 2014

41

[IEEE 2015 16th International Conference on Electronic Packaging Technology (ICEPT) - Changsha, China (2015.8.11-2015.8.14)] 2015 16th International Conference on Electronic Packaging Technology (ICEPT) - A novel pin-pull tester and its application on PCB pad cratering assessment

Li, Nanbo, Cai, Miao, Zheng, Jianna, Han, Shunfeng, Deng, Riyang, Wu, Boyi, Xie, Dongji, Yang, Daoguo

Year:

2015

Language:

english

File:

PDF, 1.20 MB

english, 2015

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